Battle Ax Backplate: Improved backplate design that provides structural rigidity and passive heat dissipation.
Hollow Back Panel: A hollow back panel design that allows airflow to freely pass through the heatsink. This design greatly improves heat dissipation compared to conventional GPU air cooling designs.
Efficient Airflow: With triple fans to improve air pressure and inlet volume, supporting auto-stop technology.
Reflow Soldering Technique: The process ensures that the thermal tube and the fin fit perfectly, optimizing heat dissipation performance and achieving excellent heat dissipation effects.
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